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BGM13S22F512GA-V3
Manufacturer
SiliconManufacturer Product Number
BGM13S22F512GA-V3
Description
藍芽模組(802.15.1) BGM13S Bluetooth SiP Module, 2.4GHz, 512kB Flash, +8dBm
Manufacturer Standard Lead Time
10-15
Detailed Description
Product Attributes
| Type | Description |
|---|---|
| Category | Boxes, Enclosures, Racks andBox Components |
| Operating Temperature | -40℃~85℃ |
| Tian Xian Type | Integrated, chip |
| Fa She Power | 8dBm |
| Operating Voltage | 1.8V~3.8V |
| Xie Yi | Bluetooth v5.0 |
| He Xin Xin Pian | EFR32BG13 |
| Jie Kou | I²C, I²S, IrDA, SPI, UART |
| Jie Shou Sensitivity | -102.1dBm |
Documents & Media
| Resource Type | Link |
|---|
Environmental & Export Classifications
| Attribute | Description |
|---|
Additional Resources
| Attribute | Description |
|---|
In Stock: 0
| Quantity | Unit Price | Ext Price |
|---|
Price For：Each
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