Manufacturer
SiliconManufacturer Product Number
BGM13S22F512GA-V3R
Description
藍芽模組(802.15.1) BGM13S Bluetooth SiP Module, 2.4GHz, 512kB Flash, +8dBm
Manufacturer Standard Lead Time
10-15
Detailed Description
| Type | Description |
|---|---|
| Category | Boxes, Enclosures, Racks andBox Components |
| Operating Temperature | -40℃~85℃ |
| Tian Xian Type | Integrated, chip |
| Fa She Power | 8dBm |
| Operating Voltage | 1.8V~3.8V |
| Xie Yi | Bluetooth v5.0 |
| He Xin Xin Pian | EFR32BG13 |
| Jie Shou Current | 10.5mA |
| Jie Kou | I²C, I²S, IrDA, SPI, UART |
| Fa She Current | 8.9mA |
| Jie Shou Sensitivity | -102.1dBm |
| Resource Type | Link |
|---|
| Attribute | Description |
|---|
| Attribute | Description |
|---|
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1+ | $ 14.7067 | |
| 5+ | $ 13.4812 | |
| 10+ | $ 12.2544 | |
| 50+ | $ 11.6445 | |
| 100+ | $ 11.0331 | |
| 250+ | $ 10.2046 |
Minimum:1/Multiple:1
Total amount: