Manufacturer
SiliconManufacturer Product Number
BGM113A256V2
Description
--
Manufacturer Standard Lead Time
5-7个
Detailed Description
| Type | Description |
|---|---|
| Category | Boxes, Enclosures, Racks andBox Components |
| Operating Temperature | -40℃~85℃ |
| Tian Xian Type | Integrated, chip |
| He Xin Xin Pian | EFR32BG |
| Jie Shou Sensitivity | -93dBm |
| Jie Kou | SPI, UART |
| Xie Yi | Bluetooth v4.1 |
| Fa She Power | 3dBm |
| Jie Shou Current | 8.7mA |
| Operating Voltage | 3.8V |
| Fa She Current | 8.8mA |
| Resource Type | Link |
|---|
| Attribute | Description |
|---|
| Attribute | Description |
|---|
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1+ | $ 8.8524 | |
| 10+ | $ 8.5544 |
Minimum:1/Multiple:1
Total amount: