Manufacturer
SiliconManufacturer Product Number
BGM123A256V2R
Description
--
Manufacturer Standard Lead Time
10-15
Detailed Description
| Type | Description |
|---|---|
| Category | Boxes, Enclosures, Racks andBox Components |
| Operating Temperature | -40℃~85℃ |
| Tian Xian Type | Integrated, chip |
| Fa She Power | 8dBm |
| Jie Kou | I²C, I²S, SPI, UART |
| He Xin Xin Pian | - |
| Jie Shou Sensitivity | -90dBm |
| Operating Voltage | 1.85V~3.8V |
| Xie Yi | Bluetooth v4.2 |
| Fa She Current | 8.2mA |
| Jie Shou Current | 9mA |
| Resource Type | Link |
|---|
| Attribute | Description |
|---|
| Attribute | Description |
|---|
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1+ | $ 12.4925 | |
| 5+ | $ 11.3854 | |
| 10+ | $ 10.2784 | |
| 50+ | $ 9.8898 | |
| 100+ | $ 9.4999 | |
| 250+ | $ 8.9972 |
Minimum:1/Multiple:1
Total amount: