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Today's Focus

Computing Arms Race Usheres in Capacity Lock Era, Reshaping Chip Supply Chain Rules 2026-8-20
New Round of Chip Price Hikes: Analog & Power Chips Boom, Local Brands Accelerate Substitution 2026-8-20
Memory Chip Supply-Demand Restructured: Overseas Capacity Expansion & AI-Driven Prosperity 2026-8-17
Open ISA Ecosystem Analysis: Booming Hardware, Software Bottlenecks and High-Performance Challenges 2026-8-17
Industrial Control Chips Exit Destocking Cycle, Embrace 2026 Recovery with Structural Opportunities 2026-8-11
AI Drives 12-inch Wafer Demand Surge; Inelastic Supply Sustains Structural Shortage Till 2028 2026-8-11
Accelerated Glass TGV Industrialization: Post-Moore Packaging Materials Face Mass-Production Barrier 2026-8-6
Global WBG Patent Competition Escalates, Cross-Border Litigations Define Industrial Barriers 2026-8-6
European Alliance Quintauris Launches ISO 26262-Certified Open RISC-V Platform for Automotive Chips 2026-8-5
NVIDIA Prepay Amkor $1.5B to Secure US Advanced Packaging Amid AI Capacity Race 2026-8-5
Samsung & Broadcom Sign MOU for 2030 Vertical Partnership: Storage, Foundry & Advanced Packaging 2026-8-3
Google Frozen V2 Next-Gen TPU Exposed: On-Die SRAM Cuts Reliance on Premium CoWoS Packaging 2026-8-3
AMD Launches Helios Rack Platform: AI Competition Shifts from Single‑Chip to Full‑Stack Systems 2026-7-30
Growing Memory‑Chip Supply‑Demand Imbalance: AI‑Driven HBM Fuels Continuous Price Rises 2026-7-30
Escalating Chip Geopolitics: Global Supply Chain Splits Self‑Reliant and Western‑Alliance Syste 2026-7-29
TSMC Launches COUPE Standardized CPO Platform, Co‑Packaged Optics Reaches Mass‑Production Inflection 2026-7-29
Domestic Semiconductor Equipment Makes Patent Breakthroughs in Wafer Dicing and Reticle Chucking 2026-7-28
Patent Competition Heats Up: Wolfspeed Sues Navitas, Reshaping Global GaN/SiC Patent Landscape 2026-7-28
Basic Knowledge of PCB Information 2026-7-27
Unic Semi Invests RMB 20B in Shaoxing Automotive 12-inch Fab, Mature Processes Expand Rapidly 2026-7-27
Micron Invests RMB 250B U.S. Capacity, Expands Upstream to Restructure Global Storage Supply Chains 2026-7-27
Domestic Chips Break Out at WAIC 2026: 3D Near-Memory &amp; Panel Packaging Commercialized 2026-7-23
Jiangfeng Rolls Out Mass 300mm High-Purity Silicon Targets for Domestic Semiconductor Breakthrough 2026-7-23
Jingjia Acquires Full AlN Patents, Only Firm with Independent GaN & AlN Substrate IP 2026-7-22
Anthropic Speeds Up Custom Chips, Partners with Samsung on 2nm AI Process 2026-7-22
TSMC, Intel, Samsung Shift Focus to Advanced Packaging and New Materials 2026-7-21
Intel Unveils XBM Memory Patent to Compete in Post-HBM Storage Tech Era 2026-7-21
Global Optical Chip Capacity Race; 70% InP Gap, CPO Hits Critical Industrial Window 2026-7-20
Apple & Broadcom $30B Long-Term Tie-Up; Custom Silicon Strategy Reshapes Terminal Supply Chains 2026-7-20
CXMT Raised RMB30B Oversubscribed; Domestic DRAM Hits 1000Gb Capacity & Localization Inflection 2026-7-17

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