Manufacturer
XUNPUManufacturer Product Number
TF-115Y-BCP9
Description
--
Manufacturer Standard Lead Time
2-5
Detailed Description
| Type | Description |
|---|---|
| Category | Boxes, Enclosures, Racks andBox Components |
| Contact Plating | Tin |
| Insertion/Extraction Method | Spring-loaded |
| Ka De Type | MicroSD Card (TF Card) |
| Ben Ti Zui Da Height | 1.8mm |
| Operating Temperature | -25℃ ~ 90℃ |
| Resource Type | Link |
|---|
| Attribute | Description |
|---|
| Attribute | Description |
|---|
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 5+ | $ 0.0752 | |
| 50+ | $ 0.0585 | |
| 150+ | $ 0.0501 | |
| 1000+ | $ 0.0446 | |
| 2000+ | $ 0.0390 |
Minimum:1/Multiple:1
Total amount: