Manufacturer
HANXIAManufacturer Product Number
HX NANO SIM XG6P H1.35
Description
--
Manufacturer Standard Lead Time
2-5
Detailed Description
| Type | Description |
|---|---|
| Category | Boxes, Enclosures, Racks andBox Components |
| Ben Ti Zui Da Height | 1.35mm |
| Contact Plating | Gold |
| Contact Material | Phosphor bronze |
| Ka De Type | Nano SIM card |
| Insertion/Extraction Method | Flip-type |
| Operating Temperature | -40℃ ~ 70℃ |
| Resource Type | Link |
|---|
| Attribute | Description |
|---|
| Attribute | Description |
|---|
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 5+ | $ 0.1462 | |
| 50+ | $ 0.1128 | |
| 150+ | $ 0.0975 |
Minimum:1/Multiple:1
Total amount: