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TTD18P10AT

Manufacturer

UNIS

Manufacturer Product Number

TTD18P10AT

Description

Trench MOS这种新型垂直结构器件在VDMOS的基础上发展起来,和VDMOS相比,Trench MOS拥行更低的导通屯阻和栅漏电荷密度,因而拥行更低的导通和开义损耗及更快的开义速度。 同时由于Trench MOS的沟逍是垂直的, 故可进一步提高具沟逍密度, 减小芯片尺寸, 降低导通电阻。 )并且具有MOS器件的一切优点, 如: 开关速度快、 驱动功率小等。并联的元胞具有负的温度系数,有利于大电流和更宽的安全工作区的实现。

Manufacturer Standard Lead Time

3-5

Detailed Description

Trench MOS这种新型垂直结构器件在VDMOS的基础上发展起来,和VDMOS相比,Trench MOS拥行更低的导通屯阻和栅漏电荷密度,因而拥行更低的导通和开义损耗及更快的开义速度。 同时由于Trench MOS的沟逍是垂直的, 故可进一步提高具沟逍密度, 减小芯片尺寸, 降低导通电阻。 )并且具有MOS器件的一切优点, 如: 开关速度快、 驱动功率小等。并联的元胞具有负的温度系数,有利于大电流和更宽的安全工作区的实现。

Product Attributes

Type Description
Category Boxes, Enclosures, Racks andBox Components
Drain-Source Voltage 100 V
Type 1 P-Channel
Continuous Drain Current 18A
Operating Temperature -55℃ ~ +175℃
Threshold Voltage 1.7 V @ 250 μA
Gate Charge 70nC@10V
Power 113W
Reverse Transfer Capacitance 53pF@50V
On-Resistance 80mΩ@10V,9A
Input Capacitance 4.182nF@50V

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