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XKSIM-1130-1
Manufacturer
XKBManufacturer Product Number
XKSIM-1130-1
Description
卡座连接器 Micro SIM H1.50
Manufacturer Standard Lead Time
5-7个
Detailed Description
Product Attributes
| Type | Description |
|---|---|
| Category | Boxes, Enclosures, Racks andBox Components |
| Operating Temperature | -25℃~85℃ |
| Contact Material | Copper alloy |
| Insertion/Extraction Method | Spring-loaded |
| Contact Plating | Gold |
| Ka De Type | Micro SIM Card |
| Ben Ti Zui Da Height | 1.5mm |
Documents & Media
| Resource Type | Link |
|---|
Environmental & Export Classifications
| Attribute | Description |
|---|
Additional Resources
| Attribute | Description |
|---|
In Stock: 1,788
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1+ | $ 0.7046 | |
| 10+ | $ 0.6308 | |
| 30+ | $ 0.5946 | |
| 100+ | $ 0.5584 | |
| 500+ | $ 0.4930 | |
| 1000+ | $ 0.4818 |
Price For：Each
Minimum:1/Multiple:1
Total amount:
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